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LEADER 00000cam  2200589Ma 4500 
001    1103260099 
003    OCoLC 
005    20191115045357.1 
006    m     o  d         
007    cr |n||||||||| 
008    110412s2011    enka    ob    001 0 eng d 
019    827454893|a866858731|a880416419 
020    9780857092892|q(e-book) 
020    0857092898 
020    |z9781845695767 
020    |z1845695763|q(print) 
035    (OCoLC)1103260099|z(OCoLC)827454893|z(OCoLC)866858731
       |z(OCoLC)880416419 
037    CL0500000431|bSafari Books Online 
040    VT2|beng|epn|erda|cVT2|dOCLCO|dYDXCP|dE7B|dOPELS|dN$T|dUMI
       |dDEBBG|dDEBSZ|dEBLCP|dOCLCF|dU3W|dD6H|dCEF|dESU|dUAB|dAUD
       |dOCLCQ 
049    MAIN 
050  4 TK7871|b.A38 2011 
072  7 TEC|x009070|2bisacsh 
082 04 621.381|223 
245 00 Advanced adhesives in electronics :|bmaterials, properties
       and applications /|cedited by M.O. Alam and C. Bailey. 
264  1 Cambridge :|bWoodhead Pub.,|c2011. 
300    1 online resource (x, 268 pages) :|billustrations. 
336    text|btxt|2rdacontent 
337    computer|bc|2rdamedia 
338    online resource|bcr|2rdacarrier 
347    text file|2rdaft|0http://rdaregistry.info/termList/
       fileType/1002 
490 1  Woodhead Publishing in materials. 
504    Includes bibliographical references and index. 
505 0  pt. 1. Types of adhesives -- pt. 2. Processing and 
       properties. 
520    Adhesives for electronic applications serve important 
       functional and structural purposes in electronic 
       components and packaging, and have developed significantly
       over the last few decades. Advanced adhesives in 
       electronics reviews recent developments in adhesive 
       joining technology, processing and properties. The book 
       opens with an introduction to adhesive joining technology 
       for electronics. Part one goes on to cover different types
       of adhesive used in electronic systems, including 
       thermally conductive adhesives, isotropic and anisotropic 
       conductive adhesives and underfill adhesives for flip-chip
       applications. Part two focuses on the properties and 
       processing of electronic adhesives, with chapters covering
       the structural integrity of metal-polymer adhesive 
       interfaces, modelling techniques used to assess adhesive 
       properties and adhesive technology for photonics. With its
       distinguished editors and international team of 
       contributors, Advanced adhesives in electronics is a 
       standard reference for materials scientists, engineers and
       chemists using adhesives in electronics, as well as those 
       with an academic research interest in the field. Reviews 
       recent developments in adhesive joining technology, 
       processing and properties featuring flip-chip 
       applicationsProvides a comprehensive overview of adhesive 
       joining technology for electronics including different 
       types of adhesives used in electronic systemsFocuses on 
       the properties and processing of electronic adhesives, 
       with chapters covering the structural integrity of metal-
       polymer adhesive interfaces and modelling techniques. 
650  0 Electronics|xMaterials.|0http://id.loc.gov/authorities/
       subjects/sh85042388 
650  0 Coatings.|0http://id.loc.gov/authorities/subjects/
       sh85027504 
650  0 Sealing compounds.|0http://id.loc.gov/authorities/subjects
       /sh85119313 
700 1  Alam, M. O.|q(Mohammad O.)|0http://id.loc.gov/authorities/
       names/nb2011028276 
700 1  Bailey, C. 
776 08 |iPrint version:|tAdvanced adhesives in electronics.
       |dCambridge, UK ; Philadelphia, PA, USA : Woodhead Pub., 
       2011|z9781845695767|z1845695763. 
830  0 Woodhead Publishing in materials.|0http://id.loc.gov/
       authorities/names/no2005092801 
990    ProQuest Safari|bO'Reilly Safari Learning Platform: 
       Academic edition|c2019-11-15|yMaster record variable 
       field(s) change: 505|5OH1 
990    ProQuest Safari|bO'Reilly Safari Learning Platform: 
       Academic edition|c2019-06-07|yOCLC control number change
       |5OH1 
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