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EBOOK
Title Mechanical sciences : the way forward / Uday S. Dixit, Santosha Kumar Dwivedy, editors.
Imprint Singapore : Springer, [2021]

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LOCATION CALL # STATUS MESSAGE
 OHIOLINK SPRINGER EBOOKS    ONLINE  
View online
Subject Mechanical engineering -- India -- History.
Mechanical engineering.
Fluid mechanics.
Thermodynamics.
Heat engineering.
Heat -- Transmission.
Mass transfer.
Vibration.
Dynamics.
Mechanics.
Mechanics, Applied.
Alt Name Dixit, Uday S.,
Dwivedy, S. K. (Santosha K.),
Description 1 online resource (xvii, 267 pages) : illustrations (some color)
Contents Design and Dynamics -- Fluid Mechanics and Thermal Science -- Intelligent Fabrication & Manufacturing at Microscale -- Intelligent and Smart Materials for Mechanical Systems -- Computational Techniques -- Robotics and Autonomous System, Internet of Things -- Electric Vehicle.
Summary This book consists of review articles by experts on recent developments in mechanical engineering sciences. The book has been composed to commemorate the Silver Jubilee of the Mechanical Engineering Department, Indian Institute of Technology Guwahati. It includes articles on modern mechanical sciences subjects of advanced simulation techniques and molecular dynamics, microfluidics and microfluidic devices, energy systems, intelligent fabrication, microscale manufacturing, smart materials, computational techniques, robotics and their allied fields. It presents the upcoming and emerging areas in mechanical sciences which will help in formulation of new courses and updating existing curricula. This book will help the academicians and policy makers in the field of engineering education to chart out the desired path for the development of technical education.
Note Online resource; title from digital title page (viewed on November 04, 2020).
ISBN 9789811557125 (electronic book)
9811557128 (electronic book)
981155711X
9789811557118
ISBN/ISSN 10.1007/978-981-15-5712-5
OCLC # 1198132702
Additional Format Print version: Dixit, Uday S. Mechanical Sciences : The Way Forward. Singapore : Springer Singapore Pte. Limited, 2020 9789811557118



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